View HC367_9052622.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

scls309d ? january 1996 ? revised september 2003 1 post office box 655303 ? dallas, texas 75265 wide operating voltage range of 2 v to 6 v high-current 3-state outputs drive bus lines, buffer memory address registers, or drive up to 15 lsttl loads true outputs low power consumption, 80- a max i cc typical t pd = 10 ns 6-ma output drive at 5 v low input current of 1 a max description/ordering information these hex buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. the ?HC367 devices are organized as dual 4-line and 2-line buffers/drivers with active-low output-enable (1oe and 2oe ) inputs. when oe is low, the device passes noninverted data from the a inputs to the y outputs. when oe is high, the outputs are in the high-impedance state. ordering information t a package ? orderable part number top-side marking pdip ? n tube of 25 sn74HC367n sn74HC367n tube of 40 sn74HC367d soic ? d reel of 2500 sn74HC367dr HC367 ?40 c to 85 c soic ? d reel of 250 sn74HC367dt HC367 ?40 c to 85 c sop ? ns reel of 2000 sn74HC367nsr HC367 tube of 90 sn74HC367pw tssop ? pw reel of 2000 sn74HC367pwr HC367 tssop ? pw reel of 250 sn74HC367pwt HC367 cdip ? j tube of 25 snj54HC367j snj54HC367j ?55 c to 125 c cfp ? w tube of 150 snj54HC367w snj54HC367w ?55 c to 125 c lccc ? fk tube of 55 snj54HC367fk snj54HC367fk ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications o f texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 3212019 910111213 4 5 6 7 8 18 17 16 15 14 2a2 2y2 nc 2a1 2y1 1y1 1a2 nc 1y2 1a3 1a1 1oe nc 1y4 1a4 v 2oe 1y3 gnd nc sn54HC367 . . . fk package (top view) cc nc ? no internal connection 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1oe 1a1 1y1 1a2 1y2 1a3 1y3 gnd v cc 2oe 2a2 2y2 2a1 2y1 1a4 1y4 sn54HC367 ...j or w p ackage sn74HC367 . . . d, n, ns, or pw package (top view) copyright ? 2003, texas instruments incorporated
scls309d ? january 1996 ? revised september 2003 2 post office box 655303 ? dallas, texas 75265 function table (each buffer/driver) inputs output oe a output y h x z l hh l l l logic diagram (positive logic) 1oe to three other channels 1a1 1y1 1 23 2oe to one other channel 2a1 2y1 15 12 11 pin numbers shown are for the d, j, n, ns, pw, and w packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input clamp current, i ik (v i < 0 or v i > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output clamp current, i ok (v o < 0 or v o > v cc ) (see note 1) 20 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous output current, i o (v o = 0 to v cc ) 35 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous current through v cc or gnd 70 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 2): d package 73 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . n package 67 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ns package 64 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . pw package 108 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. the package thermal impedance is calculated in accordance with jesd 51-7.
scls309d ? january 1996 ? revised september 2003 3 post office box 655303 ? dallas, texas 75265 recommended operating conditions (see note 3) sn54HC367 sn74HC367 unit min nom max min nom max unit v cc supply voltage 2 5 6 2 5 6 v v cc = 2 v 1.5 1.5 v ih high-level input voltage v cc = 4.5 v 3.15 3.15 v v ih high-level input voltage v cc = 6 v 4.2 4.2 v v cc = 2 v 0.5 0.5 v il low-level input voltage v cc = 4.5 v 1.35 1.35 v v il low-level input voltage v cc = 6 v 1.8 1.8 v v i input voltage 0 v cc 0 v cc v v o output voltage 0 v cc 0 v cc v v cc = 2 v 1000 1000 ? t/ ? v input transition rise/fall time v cc = 4.5 v 500 500 ns ? t/ ? v input transition rise/fall time v cc = 6 v 400 400 ns t a operating free-air temperature ?55 125 ?40 85 c note 3: all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs , literature number scba004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions v cc t a = 25 c sn54HC367 sn74HC367 unit parameter test conditions v cc min typ max min max min max unit 2 v 1.9 1.998 1.9 1.9 i oh = ?20 a 4.5 v 4.4 4.499 4.4 4.4 v oh v i = v ih or v il i oh = ?20 a 6 v 5.9 5.999 5.9 5.9 v v oh v i = v ih or v il i oh = ?6 ma 4.5 v 3.98 4.3 3.7 3.84 v i oh = ?7.8 ma 6 v 5.48 5.8 5.2 5.34 2 v 0.002 0.1 0.1 0.1 i ol = 20 a 4.5 v 0.001 0.1 0.1 0.1 v ol v i = v ih or v il i ol = 20 a 6 v 0.001 0.1 0.1 0.1 v v ol v i = v ih or v il i ol = 6 ma 4.5 v 0.17 0.26 0.4 0.33 v i ol = 7.8 ma 6 v 0.15 0.26 0.4 0.33 i i v i = v cc or 0 6 v 0.1 100 1000 1000 na i oz v o = v cc or 0 6 v 0.01 0.5 10 5 a i cc v i = v cc or 0, i o = 0 6 v 8 160 80 a c i 2 v to 6 v 3 10 10 10 pf
scls309d ? january 1996 ? revised september 2003 4 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1) parameter from to v cc t a = 25 c sn54HC367 sn74HC367 unit parameter from (input) to (output) v cc min typ max min max min max unit 2 v 50 95 145 120 t pd a y 4.5 v 12 19 29 24 ns t pd a y 6 v 10 16 25 20 ns 2 v 100 190 285 238 t en oe y 4.5 v 26 38 57 48 ns t en oe y 6 v 21 32 48 41 ns 2 v 50 175 265 240 t dis oe y 4.5 v 21 35 53 48 ns t dis oe y 6 v 19 30 45 41 ns 2 v 28 60 90 75 t t any 4.5 v 8 12 18 15 ns t t any 6 v 6 10 15 13 ns switching characteristics over recommended operating free-air temperature range, c l = 150 pf (unless otherwise noted) (see figure 1) parameter from to v cc t a = 25 c sn54HC367 sn74HC367 unit parameter from (input) to (output) v cc min typ max min max min max unit 2 v 70 120 180 150 t pd a y 4.5 v 17 24 36 30 ns t pd a y 6 v 14 20 31 25 ns 2 v 140 230 345 285 t en oe y 4.5 v 30 46 69 57 ns t en oe y 6 v 28 39 59 48 ns 2 v 45 210 315 265 t t any 4.5 v 17 42 63 53 ns t t any 6 v 13 36 53 45 ns operating characteristics, t a = 25 c parameter test conditions typ unit c pd power dissipation capacitance per buffer/driver no load 35 pf
scls309d ? january 1996 ? revised september 2003 5 post office box 655303 ? dallas, texas 75265 parameter measurement information voltage waveform input rise and fall times 50% 50% 10% 10% 90% 90% v cc 0 v t r t f input voltage waveforms propagation delay and output transition times 50% 50% 50% 10% 10% 90% 90% v cc v oh v ol 0 v t r t f input in-phase output 50% t plh t phl 50% 50% 10% 10% 90% 90% v oh v ol t r t f t phl t plh out-of-phase output 50% 10% 90% v cc v cc v ol 0 v output control (low-level enabling) output waveform 1 (see note b) 50% t pzl t plz voltage waveforms enable and disable times for 3-state outputs v oh 0 v 50% 50% t pzh t phz output waveform 2 (see note b) v cc test point from output under test c l (see note a) r l v cc s1 s2 load circuit parameter c l t pzh t pd or t t t dis t en t pzl t phz t plz 1 k ? 1 k ? 50 pf or 150 pf 50 pf open closed r l s1 closed open s2 open closed closed open 50 pf or 150 pf open open ?? notes: a. c l includes probe and test-fixture capacitance. b. waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. c. phase relationships between waveforms were chosen arbitrarily. all input pulses are supplied by generators having the followi ng characteristics: prr 1 mhz, z o = 50 ? , t r = 6 ns, t f = 6 ns. d. the outputs are measured one at a time with one input transition per measurement. e. t plh and t phl are the same as t pd . f. t plz and t phz are the same as t dis . g. t pzl and t pzh are the same as t en . figure 1. load circuit and voltage waveforms
package option addendum www.ti.com 17-dec-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples 8500201ea active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 8500201ea snj54HC367j jm38510/65708bea active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 65708bea m38510/65708bea active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 65708bea sn54HC367j active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 sn54HC367j sn74HC367d active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367dg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367dr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367dre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367drg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367dt active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type -40 to 85 sn74HC367n sn74HC367nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367pw active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367pwr active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 sn74HC367pwt active tssop pw 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 HC367 snj54HC367j active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 8500201ea snj54HC367j (1) the marketing status values are defined as follows: active: product device recommended for new designs.
package option addendum www.ti.com 17-dec-2015 addendum-page 2 lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of sn54HC367, sn74HC367 : ? catalog: sn74HC367 ? military: sn54HC367 note: qualified version definitions:
package option addendum www.ti.com 17-dec-2015 addendum-page 3 ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74HC367dr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 sn74HC367nsr so ns 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 q1 sn74HC367pwr tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 sn74HC367pwt tssop pw 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 package materials information www.ti.com 14-jul-2012 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74HC367dr soic d 16 2500 333.2 345.9 28.6 sn74HC367nsr so ns 16 2000 367.0 367.0 38.0 sn74HC367pwr tssop pw 16 2000 367.0 367.0 35.0 sn74HC367pwt tssop pw 16 250 367.0 367.0 35.0 package materials information www.ti.com 14-jul-2012 pack materials-page 2

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? products www.dlp.com consumer electronics www.ti.com/consumer-apps dsp dsp.ti.com energy and lighting www.ti.com/energy clocks and timers www.ti.com/clocks industrial www.ti.com/industrial interface interface.ti.com medical www.ti.com/medical logic logic.ti.com security www.ti.com/security power mgmt power.ti.com space, avionics and defense www.ti.com/space-avionics-defense microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com omap applications processors www.ti.com/omap ti e2e community e2e.ti.com wireless connectivity www.ti.com/wirelessconnectivity mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2015, texas instruments incorporated

▲Up To Search▲

Price & Availability of HC367

	To Download HC367 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .